DU, L. Tech Feels, Tough Minds: Exploring the Link between Technology Emotions and Digital Resilience Among Chinese Youth in the Era of Intelligent Media. The Journal of Medicine, Humanity and Media, [S. l.], v. 3, n. 4, p. 149–171, 2025. DOI: 10.62787/mhm.v3i3.217. Disponível em: http://mhmjournal.net/index.php/mhm/article/view/217. Acesso em: 18 nov. 2025.